By Joshua Piven, David Borgenicht, Ben H. Winters

Following the luck of the full Worst-Case state of affairs Survival guide (more than 150,000 copies sold!), this ruggedly good-looking assortment brings jointly new and vintage recommendation from Worst-Case specialists to assist readers grasp the manly arts—from wrestling an alligator to calming a crying baby to extinguishing yard fish fry fires.

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Extra info for Complete Worst-Case Scenario Survival Handbook: Man Skills

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2 STORAGE TECHNOLOGY As in any large computer system, a number of different storage technologies are used in MU5 in order to provide an economic balance between speed and capacity. Thus at the fastest level in the hierarchy ( figure 3. 14) associa ti vely addressed integrated circuit stores are used, while the main storage unit associated with the MU5 Processol', the Local Store, uses plated-wire technology. 5 jlS oycle-time core store, and beyond that is the Fixed-head Disc Store, which incorporates a Disc Transfer System capable of organising data transfers through the Exchange between any one of up to foul' discs and the Mass 01" Local Stores.

This Exchange has been built as an integral part of the MU5 Project using basically the same technology as that used for the MU5 Processor. Logically i t is a multiple-wid th OR gate opera ted as a packet switching system at the star point of the interconnections. This configuration involves only a very short common path for transfers between the various units and was chosen in preference to a distributed highway or 'bus' system in order to accommodate the high data rate associated with paging transfers.

An average gate thus introduces a delay of 2 ns due to propagation through the ECL circuit itself, 1 ns transmission time along the 6 in. intereonnection path and a further 1 ns delay due to input loading, giving a typical delay per gate in the system of approximately 4 ns. 5 ns, but the packaging is such that for large numbers of adjacent gates the additional transmission delay i3 very mueh less than 1 ns. V> <: " o al <: <: o U '0 ... 4 Platter Production The multi-layer platters into which the modules are connected are made up of four logic layers, two outer layers containing 45 the pads for the edge connectors, and various power layers.

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Complete Worst-Case Scenario Survival Handbook: Man Skills by Joshua Piven, David Borgenicht, Ben H. Winters
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